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Flexible-rigid PCB capability

1774 2023-04-26 ECO-GO PCB Co,.Limited
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Items

Parameters

Max Panel Size

10"×20.5"(250mm×520mm)

Min Inner Layer Line Width/Space

3mil/3mil(0.075mm/0.075mm)

Min Inner Layer Pad

3mil(0.075mm)

FPC PI Thickness

1~6MIL

Min Core Thickness

2mil(0.05mm)

Inner Layer Copper Thickness

0.5-1oz

Outer Layer Base Copper Thickness

1/3-4oz

Final Board Thickness

0.3-6.6mm

Final Board Thickness Tolerance

±10%

Layer Count

2-16

Inner Layers Registration

±2mil(±50um)

Min Mechanical Drill Size

0.15mm

Hole Position Accuracy

±2mil(±50um)

Hole Diameter Tolerance

±2mil(±50um)

Max PTH Aspect Ratio

10:01

Image To Image Tolerance

3mil/3mil(75um/75um)

Min Out Layer Line Width/Space

3mil/3mil(75mm/75mm)

Etching Tolerance

10%

Solder Mask Thickness

≥1mil(≥25um)

Min Solder Mask Dam

4mil(100um)

Max Solder Mask Plug Hole Diameter

0.50mm

Surface Treatment

HASL,Gold Finger,Plating Gold,OSP,ENIG,IMM TIN, IMM AG

Max Gold Thickness Of Gold Finger

≤30u"(≤0.75um)

Gold Thickness Of Immersin Gold

 1-3u"(0.025-0.07um)

Impedance Control And Tolerance

±10%

Peel Strength

≥61B/in(≥107g/mm)

Warp And Twist

≤0.75%

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