Focused And Professional
0755-81462604
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Thickness |
2-160mil (0.05-4.0 mm) |
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Min diameter of holes |
4mil (Laser drill); 6mil(mechanical drill) |
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Aspect ratio |
15:01 |
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Min. width/space width of outer layer(finished copper) |
3/3mil(0.5oz) ,3.5/3.5(1oz),5/5(2oz) |
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Min. width/space width of inner layer(finished copper) |
3/3mil(0.5oz) ,4/4(1oz),6/6(2oz) |
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Min distance Between drilling&conductor(buried &blind holes) |
8mil |
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The vias to the coalescent location of rigid and flex |
1mm |
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Surface |
Plating Gold |
0.25-0.76um |
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Hard gold |
0.76-2um |
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ENIG |
Ni:3–8um,Au:0.05-0.1um |
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HASL |
2-40um |
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HASL lead free |
2-38um |
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OSP |
0.15-0.30um |
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Immersion Tin |
0.80-1.20um |
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Immersion Silver |
0.10-0.30um |
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Selective surface finishing |
ENIG+GOLD Finger; ENIG+HASL; ENIG+OSP; Soft gold+ GOLD Finger; Flash gold+HASL; immersion Tin+gold finger; Immersion sliver+gold finger; OSP +gold finger; Silver ink+Plating gold; Silver ink+ENIG.ENPIG |
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Others |
Max finished copper thickness |
Internal layer: 3oz; External layer: 3oz |
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Flex pcb Layers |
0-6 |
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Rigid-flex pcb Layers |
0-14 |
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PCB thickness tolerance |
Thickness＞1mm: ±10%, Thickness≤1mm: ±0.1mm |
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finished PCB size |
Min. board size:10*10mm,Max. board size:400*650mm |
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Impedance tolerance |
±5ohm(＜50ohm), ±10%(≥50ohm) |