Rigid PCB capability

General:

Base Material:

FR4,CEM1,CEM3,High TG(150,170),Aluminium back board,Rogers ...

Min/Max Number of Layers:

1-32 layers

Max Dimension of Board:

1200*600mm

Min/Max Final Thickness Board:

0,2 mm-3.2mm

Copper Foil Thickness:

0.5-8 oz

Finished Surface:

HAL,HAL LF,Chem Ni/Au,gold plating,immersion Tin,OSP,immersion sliver

Solder Mask (types):

FSR-8000,TAIYO,MATT

Solder Mask (colors):

green,bule,red,black,yellow...........

Min Soldermask Width:

0.1mm

Min Soldermask opening:

0.08mm

Silkscreen (min line width):

0.1 mm

Silkscreen (colors):

White,yellow,Black........

Mini Line Width/Space:

0.1mm/0.1mm

Minimum SMT Pitch:

0.5mm

Min Drilling Hole:

0.1mm

Min Finished Hole Size/for Thickness Board:

0.2mm drill for 0.8mm

0.25mm drill for 1.6mm

0.3mm drill for 2.4mm

Minimum Annular Ring

0.08mm

Via hole type: (Buried, blind...)

Buried,blind,half holes

Contour type: (CNC rout, Punch, V-score)

CNC rout,punch,V-score

V-score depth / for Min Thickness Board:

1/2(<1.00mm),1/3(>1.2mm)

Min. distance of trace to V-score:

0..5mm(1.6mm),0.3mm(<0.8mm),0.8mm(2,4mm)

Min Slot Width:

0.25mm

Electrical Testing:

Types:

• only pads with through holes

• all pads with through holes and SMD pads

• flying probe

Conditions of Electrical Test:

open/short tester (V/Ohm)

Tolerance:

Hole Size (PTH):

+/- 0.075

Hole Size (NPTH):

+/-0.05

Min Solder mask registration:

10um

V-score Position:

+/-0.1

Contour rout:

+/-0.15

Board thickness:

T>0.8mm(+/-8%)  t<0.8mm(+/-10%)