FAQ Technical

WHAT IS THE MINIMUM REQUIRED CLEARANCE FROM THE PCB EDGE TO CONDUCTIVE PATTERN (COPPER) IN CASE OF MILLING OR SCORING?

PCB edge to conductive clearance is required to prevent short to the chasis and also to provide the insulation to conductive elements of the board. 

For outer layers:

Minimum clearance from PCB edge to copper (milling line): 0.30 mm 

Minimum clearance from PCB edge to copper (V-cut line): 0.50 mm

For Inner layers:

Minimum clearance from PCB edge to copper (milling line): 0.50 mm 

Minimum clearance from PCB edge to copper (V-cut line): 0.50 mm

HOW TO AVOID ANSWERING STUPID QUERIES?

All queries that are not affecting your design are not always stupid queries. Know your manufacturer’s limitations and intension for asking such queries. Support him in smooth running of your job in the production. 

You can avoid basic questions by just attaching one readme file with the following details: 

· List of file identification.

· Detail for the gerber format in case of gerber-d files.

· Detail of PTH / NPTH holes.

· Details for any other special requirements .

And answers to frequently asked questions:

· May we remove of non functional pads in inner layers?.

· Adding copper thieving for better plating is allowed?.

· Is there any logo placement restrictions?.

· May we add "teardrop" at trace and pad intersections?.

· May we rim void if a land appears where a non-plated through-hole is placed? .

· May we give gang opening to the fine pitch SMT packages if spacing does not permit for solder mask dam? .

· If hole size tolerances are not called out, may we use +/- 0.075 mm? .

· If PCB thickness tolerances are not called out, may we use +/- 10%? .

· If PCB size tolerance is not called out, may we use +/- 0.25 mm?.